Nordson Demonstrates Industry Leading Inspection Systems at APEX San Diego


<br /> Live Demonstrations will be available on Nordson DAGE, Nordson MATRIX and Nordson YESTECH Inspection Systems at APEX<br />




Nordson DAGE - award winning bondtester and manual x-ray inspection systems

Live Demonstrations will be available on Nordson DAGE, Nordson MATRIX and Nordson YESTECH Inspection Systems at APEX

Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #1510 and 1511 at the 2017 IPC APEX EXPO, scheduled to take Feb. 14-16, 2017 at the San Diego Convention Center in California.

 

Unbeatable X-ray Images

Nordson DAGE’s flagship system – the new Quadra™ 7 with 0.1μm sub-micron feature recognition – comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50μm pixel pitch and 6.7MP image size of the Aspire FP™ detector.

The Quadra™ 5, with industry-leading core technology, offers high performance and ease of use for 2D and 3D X-ray applications. 0.35μm feature recognition up to 10 W of power, makes the Quadra™ 5 the leading choice for printed circuit board and semiconductor package inspection.

Automated High Speed Inline Inspection for SMT Production

Designed for high-speed inspection the Nordson MATRIX X3# is an automated inspection platform which presents a flexible solution package for inline inspection of single and double-sided PCB assemblies -SMT and/or PTH-, IGBT modules and wire bonds.

The X3# movable detector axes allow high-speed off-axis image acquisition from different angles and directions using a combination of Transmission X-ray Technology, patented Slice-Filter-Technique™ (SFT), Off-Axis technology and 3D SART as required. It is optimized for speed by utilizing 2D, 2,5D or 3D inspection depending on the component requirements. The X3# is designed to be fully integrated with the site MES, paperless rework and our offline programming. The advanced Algorithm Library for sophisticated image processing ensures state-of-the-art classification.

Innovation in 3D Inspection

The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.  With its Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing and both image and rule-based algorithms, the FX-940 ULTRA offers complete inspection coverage with unsurpassed 2D and 3D defect detection.

 

Nordson Test and Inspection, 2747 Loker Avenue West, Carlsbad, CA 92010.
Tel: 1-760-930-3307, Web: www.nordsondage.com • www.nordsonmatrix.com • www.nordsonyestech.com



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