The M1m high speed chip level inspection.
The M1m offers high-speed microelectronic device inspection with exceptional defect coverage. With 5 micron pixel resolution and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 sq. meter.
Automated Optical Inspection for Microelectronics
- Megapixel color imaging
- High magnification
top-down viewing camera
- Quick set-up
- High speed
- High defect coverage
- Low false failure rate
Nordson YESTECH’s advanced megapixel technology offers high-speed PCB inspection with exceptional defect coverage. With high resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide, enabling users to improve quality and increase throughput.
Programming the M1 Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The M1 Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines.
Newly available image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.
Configurable for all line positions, the M1 Series is equally effective for paste, pre / post-reflow or final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.