Dual Awards for the Dual-sided Automated Optical Inspection System from Nordson YESTECH!

  1. Nordson YESTECH NEPCON China Awards 18
  2. Nordson YESTECH NEPCON China Awards 18
  3. Screen Shot 2018-05-08 at 11.29.01

Screen Shot 2018-05-08 at 11.29.01Nordson YESTECH, leading supplier of automated optical and conformal coat inspection systems for the electronics industry, announces that it was recognized with two awards for its FX-942 Dual-sided Automated Optical Inspection (AOI) system.  The awards were presented during Nepcon China, the prestigious global exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation) that brings together all major brands from the electronics manufacturing industry, held in Shanghai 24th– 26th April 2018.

At the SMT Vision Award Ceremony, which recognizes people and products within the surface mount industry that serve as benchmarks of excellence, the FX-942 was recognized in the category of “Inspection and Testing – AOI.”  The FX-942 was again recognized for outstanding innovation in the “Test and Inspection Systems” category of the EM Asia Innovation Awards, which was launched in 2006 to celebrate excellence in the Asian electronics industry.

The FX-942 AOI is designed for SMT and Through Hole device inspection. It is highly effective for selective solder, post wave and connector inspections and compliments the advanced selective soldering capabilities given by the Nordson SELECT systems by offering simultaneous top and bottom side inspection of PCBA’s. The YESTECH system has a Picture in Picture (PinP) feature, off-line programming to maximize machine utilization and real-time SPC monitoring to provide a valuable yield enhancement solution.

Dual sided top-down and bottom-up viewing cameras together with Nordson YESTECH’s advanced multiple color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage.  Advanced Fusion Lighting and newly available image processing technology integrates several techniques, including color inspection, normalized correlation and rule-based algorithms, to provide complete top & bottom side inspection coverage on a single platform.

Don Miller, Nordson YESTECH’s General Manager commented, “Our development team worked hard on this latest inspection technology and we are excited to receive this recognition. The FX-942’s top and bottom inspection capabilities are game changers and ideally complement Nordson’s new position in the selective solder market.”

Press Release supplied by Nordson YESTECH www.nordsonyestech.com.