Why inspect one side when you can inspect both?
The Nordson YESTECH FX 942 is specifically designed to cope with post wave or selective solder issues. With a full inspection capability on both the top and bottom sides the 942 can simultaneously inspect for components on the top side and solder joints on the bottom.
• Top, Bottom or Dual sided imaging
• Selective solder, THT and SMT inspection
• 1 top-down ( up ) and 4 side angle cameras per side
• 100 mm clearance for tall components
• High speed inspection and transfer
• High defect coverage / low false failure
• MES / Industry 4.0 compatible
• Optional 3D inspection
Automated Inspection for:
• THT Component and solder defects
• SMT Component presence and
• Wave /Selective solder joint inspection
• Correct part / polarity value