Nordson Yestech

  • FX-940_NYT_10-15F_W

    Double Sided Inspection FX 942

    The Nordson YESTECH FX 942 is specifically designed to cope with post wave or selective solder issues. With a full inspection capability on both the top and bottom sides the 942 can simultaneously inspect for components on the top side and solder joints on the bottom. Download the FX 942 Data Sheet   Features: • […]

  • M1SeriesNYTB

    M1m Microelectronic AOI

      Download the M1m datasheet. The M1m offers high-speed microelectronic device inspection with exceptional defect coverage. With 5 micron pixel resolution and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 sq. meter. Automated Optical Inspection for Microelectronics Megapixel color imaging High magnification top-down viewing camera Quick set-up High speed […]

  • FX-940_NYT_10-15F_W

    Nordson YESTECH Ultra 3D

    Nordson YESTECH Ultra 3D Download the brochure. Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage.  With one top down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput. […]

  • Xi3400

    3D In-Line Tomosynthesis X-Ray

      Nordson DAGE’s versatile Xi3400 Automated X-ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for in-line or off-line operation, the Xi3400’s innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information. By leveraging the […]

  • Automated Inspection

    FX 940 In Line AOI

      Megapixel color imaging Capture on the fly technology 1 top-down & 4 side angle cameras Quick set-up High speed High defect coverage / low false failure rate Optional 3D inspection  Nordson YESTECH’s advanced 9 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera and four […]

  • B-UV image copy

    BX Benchtop Conformal Coat Inspection

    Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. The Nordson YESTECH BX-UV makes inspection of conformal coatings simple and convenient by automating the inspection process for quality and consistency of coatings […]

  • NYT-BX_PR_10(300)

    BX Benchtop AOI

    Nordson YESTECH’s advanced 5 megapixel color camera imaging technology offers benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput. The optional four side viewing cameras add additional inspection capabilities found only on in-line systems. Programming the BX is […]

  • Automated Inspection

    FX940 Conformal Coat Inspection

    Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. The Nordson YESTECH FX-940UV makes inspection of conformal coatings simple and convenient by automating the inspection process for quality and consistency of coatings […]