BX Benchtop AOI

  1. NYT-BX_PR_10(300)
  2. B-UV image copy
  3. NYT-BX-UV_PR_10(300)
  4. FUV front side angle

BX Benchtop AOI

Nordson YESTECH’s advanced 5 megapixel color camera
imaging technology offers benchtop PCB inspection with
exceptional defect coverage. This benchtop system inspectsNYT-BX_PR_10(300)
solder joints and verifies correct part assembly enabling users
to improve quality and increase throughput. The optional four
side viewing cameras add additional inspection capabilities
found only on in-line systems.
Programming the BX is fast and intuitive. Operators typically
take less than 30 minutes to create a complete inspection
program including solder inspection. The BX utilizes a standard
package library to simplify training and ensure program
portability across manufacturing lines. Programs created with the
BX are also compatible with Nordson YESTECH’s complete
line of AOI systems.
Advanced Fusion Lighting™ and newly available 5 megapixel
image processing technology integrates several techniques,
including color inspection, normalized correlation and rulebased
algorithms, to provide complete inspection coverage with
an extremely low false failure rate.
The BX is equally effective for paste, pre / post-reflow and
even final assembly inspection. Remote programming maximizes
machine utilization and real-time SPC monitoring provides
a valuable yield enhancement solution.

 

Key Features:
• 5 megapixel color imaging
• 1 top-down and 4 side angle cameras
• Quick set-up
• High speed
• High defect coverage
• Low false failure rate

Download the BX Benchtop AOI brochure here